首页 | 官方网站   微博 | 高级检索  
     

铜及铜合金加工材热镀锡研究进展
引用本文:殷婷,田保红,刘玉亮,张毅,刘勇,王胜刚.铜及铜合金加工材热镀锡研究进展[J].上海理工大学学报,2019,40(1):55-60.
作者姓名:殷婷  田保红  刘玉亮  张毅  刘勇  王胜刚
作者单位:河南科技大学 材料科学与工程学院, 河南 洛阳 471023;有色金属共性技术河南省协同创新中心, 河南 洛阳 471023,河南科技大学 材料科学与工程学院, 河南 洛阳 471023;有色金属共性技术河南省协同创新中心, 河南 洛阳 471023,河南科技大学 材料科学与工程学院, 河南 洛阳 471023;有色金属共性技术河南省协同创新中心, 河南 洛阳 471023,河南科技大学 材料科学与工程学院, 河南 洛阳 471023;有色金属共性技术河南省协同创新中心, 河南 洛阳 471023,河南科技大学 材料科学与工程学院, 河南 洛阳 471023;有色金属共性技术河南省协同创新中心, 河南 洛阳 471023,中国科学院金属研究所, 辽宁 沈阳 110016
基金项目:河南省科技开放合作项目(172106000058);国家自然科学基金联合基金资助项目(U1704143)
摘    要:近年来,工业环保的要求越来越严格,在很大程度上制约了电镀锡技术的发展和应用。同时,随着通讯和电力产业规模的不断扩大,对镀锡铜材的需求量随之增加。镀锡铜材的抗氧化能力强,接触电阻小,因而具有良好的焊接性和导电性。热镀锡技术作为镀锡铜材生产中的一种关键工艺,具有成本低、效率高、工艺流程简单、环境友好等特点,在电工、电子、能源等领域有着广泛的应用。从热镀锡技术的原理和特点,影响热镀锡质量的关键工艺参数(包括预处理、助镀剂、镀液的成分等),常见工艺缺陷以及废锡的处理和回收等方面综述了近年来铜加工材热镀锡技术的研究进展。

关 键 词:热镀锡|铜及铜合金|表面防护|锡镀层|废锡回收
收稿时间:2018/6/21 0:00:00

Research Progress on Hot Tin Dipping Tin for Processed Copper and Copper Alloys
YIN Ting,TIAN Baohong,LIU Yuliang,ZHANG Yi,LIU Yong and WANG Shenggang.Research Progress on Hot Tin Dipping Tin for Processed Copper and Copper Alloys[J].Journal of University of Shanghai For Science and Technology,2019,40(1):55-60.
Authors:YIN Ting  TIAN Baohong  LIU Yuliang  ZHANG Yi  LIU Yong and WANG Shenggang
Affiliation:School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, China;Henan Province Collaborative Innovation Center of Nonferrous Metals, Luoyang 471023, China,School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, China;Henan Province Collaborative Innovation Center of Nonferrous Metals, Luoyang 471023, China,School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, China;Henan Province Collaborative Innovation Center of Nonferrous Metals, Luoyang 471023, China,School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, China;Henan Province Collaborative Innovation Center of Nonferrous Metals, Luoyang 471023, China,School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, China;Henan Province Collaborative Innovation Center of Nonferrous Metals, Luoyang 471023, China and Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
Abstract:Recently, the development and application of electroplating tin have been significantly constrained due to the increasingly stringent requirements of industrial environmental protection. Meanwhile, the demand for tin-plated copper is increased with the continuous expansion of the communications and power industry. Tin-dipped copper has strong antioxidant capacity and low contact resistance; therefore, it shows good weldability and conductivity. As a key technology in the production of tin-dipped copper, hot tin plating process has the advantages of low cost, high efficiency, simple procedure, and environment friendly traits. It has been widely used in the field of electrical and electronic engineering, energy engineering, and so on. Recent research progress of hot tin dipping process for copper is reviewed by introducing its principle and characteristics, key process parameters influencing the quality of hot dipping (i.e. pretreatment, flux, composition of plating solution, ect), common process defects, the treatment and recovery of scrap tin, and so on.
Keywords:hot tin dipping|copper and copper alloy|surface protection|tin coating|recovery of scrap tin
点击此处可从《上海理工大学学报》浏览原始摘要信息
点击此处可从《上海理工大学学报》下载全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司    京ICP备09084417号-23

京公网安备 11010802026262号