| 电子设备热仿真分析及软件应用 |
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| 引用本文： | 徐晓婷,朱敏波,杨艳妮.电子设备热仿真分析及软件应用[J].电子工艺技术,2006,27(5):265-268. |
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| 作者姓名： | 徐晓婷 朱敏波 杨艳妮 |
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| 作者单位： | 西安电子科技大学,陕西,西安,710071 |
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| 摘 要： | 阐述了电子设备热分析重要性并简单介绍了常用热分析软件,利用 FLOTHERM软件对一电子设备进行热分析,在此基础上对该电子设备的热控制进行改进设计,通过数值仿真获得满足热控制要求的优化设计参数,以达到工程要求;并将这一模型用FLOTHERM软件进行热分析的结果与用Icepak软件计算结果进行对比,指出两种软件在进行电子设备热设计时的差异.
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| 关 键 词： | 热设计 热设计软件 可靠性 电子设备 |
| 文章编号： | 1001-3474（2006）05-0265-04 |
| 收稿时间： | 2006-07-20 |
| 修稿时间： | 2006-07-20 |
Analysis of Thermal Simulation of Electronic System and Application of Software |
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| XU Xiao-ting,ZHU Min-bo,YANG Yan-ni.Analysis of Thermal Simulation of Electronic System and Application of Software[J].Electronics Process Technology,2006,27(5):265-268. |
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| Authors: | XU Xiao-ting ZHU Min-bo YANG Yan-ni |
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| Abstract: | The importance of the thermal analysis of electronic system is introduced.The technology characteristics of thermal design software are described.Then,the whole process of thermal analysis of some electronic system with FLOTHERM is shown.During the analysis,the thermal control means of the electronic system are improved.By numerical simulation,the optimum design parameter of the fulfilling thermal control requirement can be gained.At the same time,this model proceeds the result of the thermal analysis with the FLOTHERM with the result of the using Icepak calculation proceed contrast,thereby,pointing out the difference of these two kinds of software. |
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| Keywords: | Thermal design Thermal design software Reliability Electronic device |
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