| 热–机械应力和湿气引起QFN器件层间开裂分析 |
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| 引用本文： | 罗海萍,杨道国,李宇君.热–机械应力和湿气引起QFN器件层间开裂分析[J].电子元件与材料,2006,25(6):64-66,70. |
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| 作者姓名： | 罗海萍 杨道国 李宇君 |
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| 作者单位： | 1. 桂林电子工业学院,广西,桂林,541004
2. 桂林电子工业学院,广西,桂林,541004;代夫特工业大学,荷兰,Mekelweg,22628 |
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| 摘 要： | 采用通用有限元软件分析和计算器件在潮湿环境下的潮湿扩散,并计算由于吸潮使器件在无铅回流的高温下产生蒸汽压力,并对层间开裂现象进行分析。结果表明,气压是层间开裂的主要原因,在气压和热机械应力的作用下,层合面上的微孔洞扩张并结合起来,导致器件最后失效。
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| 关 键 词： | 电子技术 QFN封装 潮湿扩散 无铅焊 气压 层间开裂 |
| 文章编号： | 1001-2028（2006）06-0064-04 |
| 收稿时间： | 2006-01-09 |
| 修稿时间： | 2006-01-09 |
Analysis on Thermal-mechanical Stress and Moisture Driven Delamination in the QFN Package Devices |
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| LUO Hai-ping,YANG Dao-guo,LI Yu-jun.Analysis on Thermal-mechanical Stress and Moisture Driven Delamination in the QFN Package Devices[J].Electronic Components & Materials,2006,25(6):64-66,70. |
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| Authors: | LUO Hai-ping YANG Dao-guo LI Yu-jun |
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| Affiliation: | 1. Department of Mechanical Engineering Guilin University of Electronic Technology, Guilin 541004, China; 2. Delft University of Technology, Mekelweg 2, 2628 CD Delft, The Netherlands |
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| Abstract: | The finite element analysis on moisture diffusion in microelectronic plastic packages during moisture precondition by using a commercial FEA software was studied and modeled. Then, the vapor stress which induced under lead-free reflow temperature was calculated. And delamination phenomenon appear in package was also analyzed. The results indicate that the vapor pressure is a major driven force for interface delamination. Under vapor and thermo-mechanical stress, the micro holes in the interface start to expand and combine. Finally, it induced delamination. |
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| Keywords: | electronic technology QFN packages moisture diffusion lead-free reflow vapor stress delamination |
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