| 建立封装芯片热阻网络模型的方法研究 |
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| 引用本文： | 何伟,杜平安,夏汉良.建立封装芯片热阻网络模型的方法研究[J].微电子学,2011,41(1). |
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| 作者姓名： | 何伟 杜平安 夏汉良 |
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| 作者单位： | 1. 电子科技大学机械电子工程学院,成都,611731
2. 嘉利环球科技有限公司,广东,东莞,523709 |
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| 基金项目： | "嘉利-电子科大"联合实验室基金 |
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| 摘 要： | 针对电子设备系统级热分析中封装芯片模型复杂程度与计算精度的矛盾,引入热阻网络法,替代系统级分析中封装芯片的详细物理模型;并以某PBGA封装芯片为例,进行两种建模方法的对比分析,同时介绍一种快速确定网络中热阻值的方法.结果表明,热阻网络等效方法具有模型简单、分析快速、准确度高的优点,在系统级热分析中可完全替代详细的物理模型.
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| 关 键 词： | 封装芯片 等效建模 热阻网络 |
Study on Methodology of Building Thermal Resistor Network Model for Packaged Component |
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| HE Wei,DU Ping'an,XIA Hanliang.Study on Methodology of Building Thermal Resistor Network Model for Packaged Component[J].Microelectronics,2011,41(1). |
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| Authors: | HE Wei DU Ping'an XIA Hanliang |
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| Affiliation: | HE Wei1,DU Ping'an1,XIA Hanliang2(1.School of Mechatronics Engineering,University of Electronic Science and Technology of China,Chengdu 611731,P.R.China,2.Karrie Technologies Company Ltd.,Dongguan,Guangdong 523709,P.R.China) |
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| Abstract: | To deal with the conflict between complexity and accuracy of component modeling in system level thermal analysis for electronic equipments,thermal resistor network was used to replace detailed physical modeling of packaged IC in system level analysis.With a real PBGA component as an example,a comparison was made between the two methods.And a novel approach to quickly and conveniently fixing values of thermal resistors in the network was described.Results showed that the thermal resistor network features sim... |
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| Keywords: | Packaged component Equivalent modeling Thermal resistor network |
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