| 低熔点合金灌注在钛合金封装壳体加工中的应用 |
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| 引用本文： | 邱保安,蒋晓虎.低熔点合金灌注在钛合金封装壳体加工中的应用[J].电子机械工程,2009,25(3):42-45. |
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| 作者姓名： | 邱保安 蒋晓虎 |
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| 作者单位： | 南京电子技术研究所,江苏,南京,210013 |
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| 摘 要： | 针对TC4钛合金封装壳体薄壁易变形的结构特点,提出了采用低熔点合金填充至壳体内腔的工艺方法,以提高零件的刚度,解决薄壁壳体机械加工时的变形问题。文中分析了钛合金封装壳体的加工工艺难点及可以采取的工艺措施,探讨了封装壳体加工对腔内灌注填充材料的要求,着重介绍了低熔点合金的材料特性、低熔点合金成分和成分选择.此外对介绍TC4钛合金封装壳体的加工工艺作了简要的介绍。
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| 关 键 词： | 封装壳体 薄壁 刚度 加工变形 低熔点合金 |
Application of Low Melting Point Alloys to Processing of TC4 Case Packaging |
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| QIU Bao-an and JIANG Xiao-hu.Application of Low Melting Point Alloys to Processing of TC4 Case Packaging[J].Electro-Mechanical Engineering,2009,25(3):42-45. |
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| Authors: | QIU Bao-an and JIANG Xiao-hu |
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| Affiliation: | Nanjing Research Institute of Electronics Technology;Nanjing 210013;China |
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| Abstract: | TC4 case packaging is characterized by low rigidity,which is prone to machining deformation.In order to solve such a problem,a method of filling low melting point alloy into the inner cavity of the case to improve the rigidity of parts which will avoid deformation effectively,is proposed in this paper.Difficulties in the machining conditions of case packaging and the measures to be adopted are analyzed,requirements to filling materials to be filled into the inner cavity of the case are also discussed.This p... |
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| Keywords: | case pakaging thin-walled stiffness machining deformation low melting point alloy |
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