倒装焊复合SnPb焊点应变应力分析

近年来，在微电子工业中，轻、薄、短、小是目前电子封装技术发展的趋势。因此，倒装焊技术应用越来越广，而焊点的可靠性在倒装焊技术中变得越来越重要。采用有限元软件，模拟、分析了焊点高度和下填料对焊点在热载荷作用下的应力应变值。

Analysis of SnPb solder joint strain and stress in flip-chip

In recent years, with the rapid development of microelectronic industries, the reduction of feature size and growth in wafer size will continue in semiconductor industry. There is crucial need for IC packaging to move to higher density, higher performance, smaller, shorter, thinner, lighter in size and lower cost. Flip-chip technology is believed to be necessary to allow speed increase in future generation of IC. Thus, solder joint reliability in the flip-chip technology are getting more important. In the future, solder joint reliability research will play an important role. We analyzed the effect of solder joint height and underfill materials on the solder joint strain and stress under thermal loads.