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无氰镀银添加剂的研究
引用本文:苏永堂,成旦红,张炜,陈欢,徐伟一.无氰镀银添加剂的研究[J].电镀与环保,2005,25(2):11-13.
作者姓名:苏永堂  成旦红  张炜  陈欢  徐伟一
作者单位:上海大学理学院,化学系,上海,200436;上海大学理学院,化学系,上海,200436;上海大学理学院,化学系,上海,200436;上海大学理学院,化学系,上海,200436;上海大学理学院,化学系,上海,200436
摘    要:通过对含硫化合物、含氮杂环化合物、聚胺类化合物、氨基酸和表面活性剂等五类有机镀银添加剂对镀银层性能影响的研究,得出一种无氰镀银光亮剂,并施加一方向平行于电流方向的磁场可增强镀层抗变色能力.

关 键 词:无氰镀银  添加剂  协合效应
文章编号:1000-4742(2005)02-0011-03
修稿时间:2004年10月25

A Study of Additives for Cyanide-free Silver Plating
SU Yong-tang,CHENG Dan-hong,ZHANG Wei,CHEN Huan,XU Wei-yi.A Study of Additives for Cyanide-free Silver Plating[J].Electroplating & Pollution Control,2005,25(2):11-13.
Authors:SU Yong-tang  CHENG Dan-hong  ZHANG Wei  CHEN Huan  XU Wei-yi
Abstract:A new additive for cyanide-free silver plating is obtained by investig ating the effects of 5 organic silver plating additives, which contain sulfides, heterocy clic nitrogen compounds, polyamine compounds, amino acids, surfactants, etc. respectively on the performances of silver coatings. It is also found that the anti-tarnish proper ty of the coating can be improved under a magnetic field, of which the direction is parallel to c urrent direction.
Keywords:cyanide-free silver plating  additives  synergistic effect
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