| 基于PTFE的PCB的多层层压方法 |
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| 引用本文： | 丁志廉.基于PTFE的PCB的多层层压方法[J].印制电路信息,2006(3):49-54. |
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| 作者姓名： | 丁志廉 |
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| 摘 要： | 介绍了采用不同材料类型的粘结膜、半固化片、所需设备和粘结材料,用于生产低到高层数的PTFE多层板的情况。
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| 关 键 词： | 聚四氟乙烯 粘结材料 层压工艺 熔融粘接 粘接膜 复合半固化片 |
Multilayer Lamination Methods for PTFE-based PCBs |
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| Ding Zhilian.Multilayer Lamination Methods for PTFE-based PCBs[J].Printed Circuit Information,2006(3):49-54. |
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| Authors: | Ding Zhilian |
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| Affiliation: | Ding Zhilian |
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| Abstract: | This article describes the different types of applications,bonding films,equipment needs,and bonding methods used to produce low-count and high-count PTFE multiplayer boards. |
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| Keywords: | PTFE bonding materials lamination process fusion bonding bonding film hybrid prepreg |
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