Cu/Sn-58Bi-xEr_2O_3/Cu钎焊接头微观组织和力学性能的研究

研究了不同含量的纳米Er_2O_3颗粒对Sn-58Bi钎料的铺展性能、钎焊接头微观组织和力学性能的影响。结果表明,添加微量的纳米Er_2O_3颗粒细化了Sn-58Bi钎料的微观组织、改善了Sn-58Bi钎料的铺展性能和力学性能。当纳米Er_2O_3颗粒的添加量为0.075%(质量分数)时,Sn-58Bi复合钎料得到了最佳的铺展性能,比Sn-58Bi钎料的铺展系数增大了5.1%;当添加量为0.05%(质量分数)时,Sn-58Bi钎料的组织明显细化且到了最大的抗拉强度89 MPa,比Sn-58Bi共晶钎料的抗拉强度增大了11.5%。

Microstructure and mechanical properties of Cu/Sn-58Bi-xEr2O3/Cu brazed joint

The effect of minute nano-Er2O3particles on the wettability, microstructure and mechanical properties of Sn-58Bi solder was investigated. The results revealed that the microstructure of the solder is refined, the spreadability and mechanical properties of the composite solder are also improved with the addition of nano-Er2O3particles. When the addition of nano-Er2O3particles is 0.075wt.%, the best spreading performance can be obtained and its spreading coefficient increases by 5.1% compared with plain Sn-58Bi solder. In addition, when the addition of nano-Er2O3particles is 0.05wt.%, the microstructure of the solder is refined and the maximum tensile strength of the composite solder is 89 MPa, whose tensile strength increases by 11% compared with the plain Sn-58Bi solder.