| 考虑热点及热量分布系统级芯片的测试规划 |
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| 引用本文： | 陈建,赵长虹,周电,周晓方.考虑热点及热量分布系统级芯片的测试规划[J].计算机辅助设计与图形学学报,2006,18(1):46-52. |
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| 作者姓名： | 陈建 赵长虹 周电 周晓方 |
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| 作者单位： | 复旦大学专用集成电路与系统国家重点实验室ICCAD研究室,上海,200433 |
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| 基金项目： | 国家科技攻关项目;中国科学院资助项目;美国国家科学基金 |
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| 摘 要： | 在Soc的测试规划时，考虑为避免在测试过程中出现热点以及测试过程中使热量均匀分布，基于建立的问题模型得到一系列的并行测试集合，再通过Bin-Packing算法构造测试规划，并进行全局的优化．对ITC＇02测试用例的实验结果表明，该方法在牺牲一定的测试时间的情况下，有效地控制了在测试时芯片温度的升高，从而避免出现由热量引起的一系列问题．
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| 关 键 词： | 系统级芯片 测试规划 热点 测试兼容图 |
| 收稿时间： | 2004-12-03 |
| 修稿时间： | 2005-04-06 |
SoC Test Scheduling with Hot-Spot Avoidance and Even Heat Distribution |
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| Chen Jian,Zhao Changhong,Zhou Dian,Zhou Xiaofang.SoC Test Scheduling with Hot-Spot Avoidance and Even Heat Distribution[J].Journal of Computer-Aided Design & Computer Graphics,2006,18(1):46-52. |
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| Authors: | Chen Jian Zhao Changhong Zhou Dian Zhou Xiaofang |
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| Abstract: | An approach based on Bin-Packing algorithm and graph theory is proposed to avoid the hot-spot and distribute heat evenly on chip surface during test scheduling.First several parallel test set(PTSs) are derived from graph models.Then Bin-Packing algorithm constructs an initial test schedule.A global optimal procedure gets the better test schedule finally.Experiment at results on ITC'02 benchmark SoCs show that this method can effectively avoid hot-spot and distribute heat evenly at the expense of a little percentage of test time. |
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| Keywords: | SoC test-schedule hot-spot test compatibility graph |
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