| 溅射沉积Cu-Mo薄膜的结构和性能 |
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| 引用本文： | 郭中正,孙勇,周铖,沈黎,殷国祥.溅射沉积Cu-Mo薄膜的结构和性能[J].中国有色金属学报,2011,21(6). |
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| 作者姓名： | 郭中正 孙勇 周铖 沈黎 殷国祥 |
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| 作者单位： | 昆明理工大学云南省新材料制备与加工重点实验室,昆明,650093 |
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| 基金项目： | 国家自然科学基金资助项目，云南省自然科学基金重点资助项目，云南省教育厅科学研究基金资助项目 |
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| 摘 要： | 用磁控溅射法制备含钼2.19%～35.15%(摩尔分数)的Cu-Mo合金薄膜,运用能谱仪(EDX)、X射线衍射仪(XRD)、透射电镜(TEM)、扫描电镜(SEM)、显微硬度仪和电阻计对薄膜成分、结构和性能进行研究.结果表明Mo添加使Cu-Mo薄膜晶粒显著细化,Cu-Mo膜呈纳米晶结构,存在Mo在Cu中的FCCCu(Mo)非平衡亚稳过饱和固溶体；随Mo含量的增加,Mo固溶度逐渐增加,而薄膜微晶体尺寸则逐渐减小,Mo的最大固溶度为30.6%.与纯Cu膜对比表明,Cu-Mo膜的显微硬度和电阻率随Mo含量的上升而持续增加.经200、400和650℃热处理1h后,Cu-Mo膜的显微硬度和电阻率均降低,降幅与热处理温度呈正相关；经650℃退火后,Cu-Mo膜基体相晶粒长大,并出现亚微米-微米级富Cu第二相.在Cu-Mo膜的XRD谱中观察到Mo(110)特征峰,Cu-Mo薄膜结构和性能形成及演变的主要原因是添加Mo引起的晶粒细化效应以及热处理中基体相晶粒的生长.
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| 关 键 词： | Cu-Mo合金薄膜 纳米晶结构 热处理 显微硬度 电阻率 |
Structures and properties of Cu-Mo thin films deposited by magnetron sputtering |
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| GUO Zhong-zheng,SUN Yong,ZHOU Cheng,SHEN Li,YING Guo-xiang.Structures and properties of Cu-Mo thin films deposited by magnetron sputtering[J].The Chinese Journal of Nonferrous Metals,2011,21(6). |
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| Authors: | GUO Zhong-zheng SUN Yong ZHOU Cheng SHEN Li YING Guo-xiang |
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| Affiliation: | GUO Zhong-zheng,SUN Yong,ZHOU Cheng,SHEN Li,YING Guo-xiang (Key Laboratory of Advanced Materials of Yunnan Province,Kunming University of Science and Technology,Kunming 650093,China) |
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| Abstract: | The Cu-Mo alloy thin films with Mo content of 2.19%-35.15%(mole fraction) were prepared by magnetron sputtering.The compositions,structures and properties of thin films were investigated by EDX,XRD,TEM,SEM,microhardness instrument and resistivity meter.The results show that Mo addition refines the grain of Cu-Mo thin films significantly.Cu-Mo thin films possess nanocrystalline structure with the presence of FCC Cu(Mo) nonequilibrium metastable supersaturated solid solution,the Mo solubility gradually increa... |
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| Keywords: | Cu-Mo alloy thin films nanocrystalline structure heat treatment microhardness electrical resistivity |
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