| 应用双电场减小阳极键合过程中MEMS器件可动部件的损伤 |
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| 引用本文： | 杨道虹,徐晨,沈光地.应用双电场减小阳极键合过程中MEMS器件可动部件的损伤[J].半导体学报,2004,25(10):1249-1252. |
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| 作者姓名： | 杨道虹 徐晨 沈光地 |
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| 作者单位： | 北京工业大学电子信息与控制过程学院,北京市光电子技术实验室,北京,100022;北京工业大学电子信息与控制过程学院,北京市光电子技术实验室,北京,100022;北京工业大学电子信息与控制过程学院,北京市光电子技术实验室,北京,100022 |
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| 摘 要： | 提出了采用双电场对硅/玻璃进行阳极键合的方法.采用这种方法,能够有效地避免和减少键合过程中的静电力对MEMS器件的可动敏感部件的损伤和破坏,同时实验结果也验证了该方法.
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| 关 键 词： | 微电子机械系统 阳极键合 双电场 |
Applying Double Electric Fields to Avoid Deteriorating Movable Sensitive Parts in MEMS During Anodic Bonding |
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| Yang Daohong,Xu Chen and Shen Guangdi.Applying Double Electric Fields to Avoid Deteriorating Movable Sensitive Parts in MEMS During Anodic Bonding[J].Chinese Journal of Semiconductors,2004,25(10):1249-1252. |
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| Authors: | Yang Daohong Xu Chen and Shen Guangdi |
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| Abstract: | Anodic bonding between silicon and glass with dou bl e electric fields is presented.By this means,the damage caused by the electric f ield to the movable part during bonding can be avoided and the experiment result s show that. |
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| Keywords: | micro-electronic machine system anodic bondin g double electric fields |
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