| 低温共烧陶瓷(LTCC)技术应用进展 |
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| 引用本文： | 曾志毅,王浩勤,尉旭波.低温共烧陶瓷(LTCC)技术应用进展[J].磁性材料及器件,2007,38(2):7-10,22. |
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| 作者姓名： | 曾志毅 王浩勤 尉旭波 |
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| 作者单位： | 电子科技大学,电子科学技术研究院,四川成都,610054 |
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| 摘 要： | 作为一种新兴的集成封装技术,低温共烧陶瓷(LTCC)技术以其优良的高频和高速传输特性、小型化、高可靠而备受关注.介绍了低温共烧陶瓷技术的工艺、材料特性、应用及发展趋势,分析其在功能模块领域应用的可行性.
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| 关 键 词： | LICC技术 工艺 材料特性 应用 发展趋势 |
| 文章编号： | 1001-3830（2007）02-0007-04 |
| 修稿时间： | 2007-01-262007-03-07 |
Development of Low Temperature Co-fired Ceramic (LTCC) Technology |
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| ZENG Zhi-yi,WANG Hao-qin,WEI Xu-bo.Development of Low Temperature Co-fired Ceramic (LTCC) Technology[J].Journal of Magnetic Materials and Devices,2007,38(2):7-10,22. |
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| Authors: | ZENG Zhi-yi WANG Hao-qin WEI Xu-bo |
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| Abstract: | As a new integrating and packing technology, the low temperature co-fired ceramic (LTCC) technology attracts close attention for its excellent high frequency and high speed transfer characteristics, miniaturization, high reliability. In this paper, the technics, material characteristics, application and development trend of LTCC technology are introduced, and its application feasibility in the function module area is analyzed. |
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| Keywords: | LTCC technology process material characteristics application development trend |
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