| 陶瓷封装的等效热方法及其仿真验证 |
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| 引用本文： | 朱思雄,张振越,周立彦,李祝安,王剑峰.陶瓷封装的等效热方法及其仿真验证[J].电子与封装,2021(4):32-35. |
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| 作者姓名： | 朱思雄 张振越 周立彦 李祝安 王剑峰 |
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| 作者单位： | 中国电子科技集团公司第五十八研究所 |
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| 摘 要： | 利用等效热模型理论,对陶瓷封装器件与测试印制电路板(Printed Circuit Board,PCB)的模型热阻进行了等效计算,并使用Icepak热分析软件进行热仿真模拟,计算得到芯片到环境的热阻值,最后通过使用T3Ster-热阻测试仪得到陶瓷器件表面温度分布情况并计算出实际热阻。研究表明,通过等效热模型仿真热阻与未等效前的仿真热阻值及实际热阻值有良好的一致性,表明了所采用的等效热模型仿真计算方法的可行性。
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| 关 键 词： | 陶瓷封装 等效热模型 仿真 |
The Simulation and Verification of Equivalent Thermal Method for Ceramic Package |
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| ZHU Sixiong,ZHANG Zhenyue,ZHOU Liyan,LI Zhu'an,WANG Jianfeng.The Simulation and Verification of Equivalent Thermal Method for Ceramic Package[J].Electronics & Packaging,2021(4):32-35. |
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| Authors: | ZHU Sixiong ZHANG Zhenyue ZHOU Liyan LI Zhu'an WANG Jianfeng |
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| Affiliation: | (China Electronics Technology Group Corporation No.58 Research Institute,Wuxi 214035,China) |
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| Abstract: | The model of ceramic package device and testing Printed Circuit Board(PCB)has been equivalently calculated by using the theory of equivalent heat model in this article.The thermal resistance has been simulated by the Icepak which is a software of thermal analysis.Temperature distribution of the ceramic package device has been tested and calculated by the T3ster machine which is a thermal resistance tester.The results show that the thermal resistance calculated by using the method of equivalent thermal model has a good consistency with the testing value.It indicates there is a feasibility of the thermal equivalent method to calculate the thermal resistance. |
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| Keywords: | ceramic package equivalent thermal model simulation |
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