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银-纳米SiO2脉冲复合电镀工艺条件的优化与性能研究
引用本文:苏永堂,成旦红,张庆,王建泳,郭长春.银-纳米SiO2脉冲复合电镀工艺条件的优化与性能研究[J].电镀与涂饰,2005,24(10):5-7.
作者姓名:苏永堂  成旦红  张庆  王建泳  郭长春
作者单位:上海大学理学院化学系,上海,200436;上海大学环境与化学工程学院,上海,200072
摘    要:采用正交试验,以镀层显微硬度为评价标准,得到银-纳米SiO2脉冲复合电镀的最佳工艺条件为:6 mg/L的阳离子表面活性剂,100mg/L的非离子表面活性剂,15g/L的纳米SiO2,脉宽0.5ms,占空比40%,脉冲平均电流密度0.8~1.1A/dm2.正交试验结果表明,纳米SiO2含量对镀层的影响较大.该镀液分散能力(采用远近阴极法测定)为61%,覆盖能力近似为100%,镀层硬度为246.5HV,钎焊性较好。经研究发现,空气搅拌较机械搅拌更有利于纳米微粒在镀层中的分散.XRD测试得出,复合镀层在(111)面上的择优取向得到显著加强,进一步证实该镀层结晶致密,耐蚀性较纯银镀层好。

关 键 词:脉冲电镀  银-纳米SiO2复合镀层  正交试验  硬度  分散能力  覆盖能力  钎焊性
文章编号:1004-227X(2005)10-0005-03
收稿时间:2005-05-25
修稿时间:2005-08-12

Optimization of Ag-nano-SiO2 pulse composite electroplating process and properties of bath and deposits
SU Yong-tang,CHENG Dan-hong,ZHANG Qing,WANG Jian-yong,GUO Chang-chun.Optimization of Ag-nano-SiO2 pulse composite electroplating process and properties of bath and deposits[J].Electroplating & Finishing,2005,24(10):5-7.
Authors:SU Yong-tang  CHENG Dan-hong  ZHANG Qing  WANG Jian-yong  GUO Chang-chun
Affiliation:Depart. of Chem., College of Sciences , Shanghai Univ. , Shanghai 200436, China
Abstract:By orthogonal test and using the micro-hardness of deposit as evaluation criterion, the process conditions of Ag-nano- SiO2 pulse composite electroplating were optimized as follows:6 mg/L of a cationic surfactant, 100 mg/L of a nonionic surfactant,15 g/L of nano-SiO2 particles, pulse width of 0.5 ms, duty ratio of 40% , pulse average current density of 0.8 - 1. 1 A/dm2. The results of orthogonal test show that the content of nano-SiO2 particles in bath has a great influence on the deposit. The bath has a throwing power (determined by far and near cathode method) of 61% and a covering power of near to 100% , and the deposit has a micro-hardness of 246.5 HV and good solderability. Moreover, air agitation is found to be more favourable to the dispersion of nano-particles in the deposit than mechanical agitation. XRD test demonstrates that the composite deposit has a obviously stronger preferred orientation of (111) surface, which further proves that the deposit has dense crystal structure and better corrosion resistance than pure silver deposit.
Keywords:pulse electroplating  Ag-nano-SiO2 compositecoating  orthogonal test  hardness  throwing power  covering power  solderability
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