| Temperature effect in thermosonic wire bonding |
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| 作者姓名： | 吴运新 隆志力 韩雷 钟掘 |
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| 作者单位： | School of Electromechanical Engineering Cent ral South University Changsha 410083 China，School of Electromechanical Engineering Cent ral South University Changsha 410083 China，School of Electromechanical Engineering Cent ral South University Changsha 410083 China，School of Electromechanical Engineering Cent ral South University Changsha 410083 China |
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| 基金项目： | 中国科学院资助项目;国家重点基础研究发展计划(973计划) |
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| 摘 要： | 1 Introduction Currently, thermosonic wire bonding and flip chip bonding are the main electrical packaging types in first level IC chip manufacture domain. Wire bonding is simple and somewhat mature, and nowadays it holds 75% in all electrical packaging …
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| 关 键 词： | 集成电路 倒装式接合 引线接合法 粘合温度 粘结强度 超声能 |
| 收稿时间： | 2005-08-24 |
| 修稿时间： | 2006-01-12 |
Temperature effect in thermosonic wire bonding |
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| WU Yun-xin,LONG Zhi-li,HAN Lei,ZHONG Jue.Temperature effect in thermosonic wire bonding[J].Transactions of Nonferrous Metals Society of China,2006,16(3):618-622. |
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| Authors: | WU Yun-xin LONG Zhi-li HAN Lei ZHONG Jue |
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| Affiliation: | 1. Electronic and Optoelectronic System Research Laboratories, Industrial Technology Research Institute (ITRI), Hsinchu 30010, Taiwan, ROC;2. Department of Mechanical Engineering Institute of Precision Mechatronics Engineering, Minghsin University of Science and Technology, Hsinchu 30400, Taiwan, ROC;1. Materials Center Leoben Forschung GmbH, 8700 Leoben, Austria;2. STMicroelectronics SAS, 38926 Crolles, France;3. EV Group, 4782 St. Florian am Inn, Austria |
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| Abstract: | The temperature effect on bonding strength and ultrasonic transmission in a PZT transducer system was investigated. The results show that, the temperature change influences the material features of the bonding interface, such as elastic modulus, tensile strength of gold ball and Ag substrate, which results in different bonding strengths. Moreover, the temperature change also influences the impedance and dissipative ultrasonic energy in the PZT system. The current signal of PZT transducer was analyzed by join time-frequency analysis, which can reveal the current change in a bonding process more clearly and completely. The analysis shows that the bonding parameters influence mutually. These results can help build some criteria for parameter match and optimization in wire bonding processes. |
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| Keywords: | thermosonic wire bonding filp chip bonding bonding temperature bonding strength ultrasonic energy |
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