PCB镀镍金孔隙率探讨

SMT技术的兴起使有机可焊性保护涂层、化学沉镍金及电镀镍金表面处理在工业化生产中得到广泛的应用。但是这三种工艺形成的保护层较薄,不可避免的出现微孔,微孔,对表面品质有至关重要的影响,孔隙率是评价其镀层连续性的重要参数之一。本文通过试验验证的方式探讨电镀时影响镀层致密度的相关因素,总结分析出一套避免孔隙率产生的最优生产参数,为生产实际提供了理论依据。

PCB plating nickel gold porosity study

SMT technology rise of organic solderability protective coating,chemical sink nickel gold and electroplating nickel gold surface treatment in industrial production are widely used.But the three processes formation of protective coatings is thinner,unavoidable micro hole,produce microporous corrosion,which has very important influence to the surface quality.Porosity is one of the important parameters to evaluate its coating continuity.Through the verification test approach,this paper discussed the related factors affecting plating coating density,summed up optimal production parameters by a set of analysis to avoid porosity generated,and provided a theoretical basis for the actual production.