微波芯片元件的导电胶粘接工艺与应用

导电胶常用于微波组件的组装过程,其粘接强度、导电、导热和韧性等性能指标严重影响其应用范围.分析了导电胶的国内外情况和主要性能参数,总结了混合微电路对导电胶应用的指标要求.通过微波芯片元件粘接工艺过程,分析了导电胶的固化工艺与粘接强度和玻璃化转变温度的关系、胶层厚度与热阻的关系、胶点位置和大小与粘片位置控制等方面的影响关系.测试结果显示,经导电胶粘接的芯片元件的电性能和粘接强度等指标均满足设计和使用要求,产品具有较好的可靠性和一致性.

Bonding Technology and Application of Conductive Adhesive in Microwave Chip Components

Conductive adhesive is often applied to assembly process of microwave components.The adhesive strength,electrical conductivity,thermal conductivity and toughness performance of conductive adhesive have important influence on its applied range.Analyze the situation at home and abroad,and primary performance parameters of conductive adhesive.Qualifications of conductive adhesive in application of hybrid microcircuit were summarized.The relationship of cure technology schedule to adhesive strength and glass transition temperature of conductive adhesive,relationship of adhesive layer thickness and thermal resistance,control of dot size & position and adhesive position,were analyzed,through bonding technology process of microwave chip components.The result of tests showed electrical performance and adhesive strength of microwave chip components bonding by conductive adhesive,reached requirements.The final products had good reliability and consistency.