| 基于模拟的故障注入技术在高可靠处理器的应用 |
| |
| 引用本文： | 魏方巍,刘海南,黑勇.基于模拟的故障注入技术在高可靠处理器的应用[J].微电子学与计算机,2012,29(8):70-73. |
| |
| 作者姓名： | 魏方巍 刘海南 黑勇 |
| |
| 作者单位： | 中国科学院微电子研究所,北京,100029 |
| |
| 基金项目： | 国家重大科技专项(2009zx02306-003)“高可靠库单元与产品设计” |
| |
| 摘 要： | 高可靠处理器在设计过程中,需要在不同阶段采用适当的故障注入技术,对其可靠性进行验证和评估.以LEON3高可靠处理器中的TMR(Triple Module Redundancy)flip-flop为例,使用基于模拟的故障注入技术对高可靠处理器进行故障注入.通过实验表明,采用此类故障注入技术,可以在设计前期对加固设计的可靠性进行快速验证,缩短开发周期,降低验证成本.
|
| 关 键 词： | 高可靠性设计 LEON3 TMR 故障注入 |
The Application of Simulation-Based Fault Injection on High Reliable Processor |
| |
| WEI Fang-wei,LIU Hai-nan,HEI Yong.The Application of Simulation-Based Fault Injection on High Reliable Processor[J].Microelectronics & Computer,2012,29(8):70-73. |
| |
| Authors: | WEI Fang-wei LIU Hai-nan HEI Yong |
| |
| Affiliation: | (Institute of Microelectronics,Chinese Academy of Sciences,Beijing 100029,China) |
| |
| Abstract: | During the design process of high reliable processor,appropriate fault injection technologies should be adopted at different stages to analysis and evaluation the reliability of the processor.On the basis of LEON3 high reliable processor,the simulation-based fault injection has been used to inject faults into Triple Module Redundancy flip-flops.Experiments show that the simulation-based fault injection can be used in the early design stage of high reliable processor to shorten the development cycle and reduce the cost of validation. |
| |
| Keywords: | high reliability desigm LEON3 TMR fault injection |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
