n-SiO2/BGF和PEi-BGF/SiO2两类复合磨粒及抛光液对硅的抛光性能影响

以苯代三聚氰胺甲醛(BGF)微球为内核,用阳离子型聚电解质PDADMAC、阴离子型聚电解质PSS为表面改性剂,利用静电层层自组装技术,制备出不同包覆结构的n-SiO2/BGF和PEi-BGF/SiO2复合磨粒。利用TEM表征两类复合磨粒的吸附情况,并与传统单一SiO2磨粒抛光液、BGF+SiO2混合磨粒抛光液进行实验比较。通过聚合物表面的交替吸附层数、游离磨粒浓度对比两种复合磨粒抛光液对抛光的影响。抛光试验表明,复合磨粒抛光液的材料去除能力明显优于单一磨粒抛光液和混合磨粒抛光液;在两类复合磨粒抛光液对比中,当SiO2磨粒质量分数为5%时,3-SiO2/BGF和PE5-BGF/SiO2复合磨粒抛光液材料去除率达到最大值,分别为369 nm/min和361 nm/min。

n-SiO2/BGF and PEi-BGF/SiO2 Two Types of Composite Abrasives and Polishing Slurries as Well as Its Silicon Wafer CMP Performance

By using adsorption characteristics of cationic polyelectrolyte PDADMAC and anionic polyelectrolyte PSS as surface transformer on BGF particles as inner core,with the help of electrostatic self-assembly technology,two kinds of n-SiO2/BGF and PEi-BGF/SiO2 abrasive composite abrasives with variable covered structure were obtained.Using TEM characterized the SiO2 adsorption of these two kinds composite abrasives.The comparison experiments were carried out with traditional single SiO2 polishing solution,BGF＋SiO2 mixed abrasive polishing solution.The experiments showed that the material removal capability of composite abrasive slurry is superior to the single SiO2 abrasive slurry and mixed abrasive slurry.The modified 3-SiO2/BGF and PE5-BGF/SiO2 composite abrasives slurry yielded highest material removal rate（369 nm/min and 361 nm/min respectively） with 5% free SiO2 abrasives in slurry.