基于有限元分析的笔记本纸浆模制品包装改进设计

目的在跌落工况下验证笔记本纸浆模制品对产品的保护性,并进行改进设计。方法使用Creo对笔记本电脑及缓冲包装结构进行初步设计,根据实际的物理跌落试验工况建立跌落仿真模型,通过ABAQUS/Explicit进行仿真分析,得到产品跌落加速度曲线和产品应力应变云图。根据仿真结果进行缓冲包装设计改进,对改进后的方案再次进行仿真分析并进行试验验证。结果初步设计方案的正面跌落加速度达到160.1g,超过规定值120g,且键盘面板塑性应变达到4.95%,存在较大变形风险。纸浆模制品缓冲结构改进后,跌落时正面、侧面和底面的跌落加速度分别为118.5g、98.2g、101.2g,均处于规定值范围内。键盘面板塑性应变降低至0.14%,符合要求。此外,仿真数据与实测结果基本吻合,仿真过程能较好地反映包装制品与产品的跌落碰撞过程。结论通过有限元分析法进行跌落仿真分析,相较于传统的试验法,能快速、准确地找到包装方案的风险点,可为产品的缓冲包装结构改进设计奠定良好基础。

Design Improvement of Molded Pulp Package for Laptop Computer Based on Finite Element Analysis

The work aims to verify the protection of molded pulp package of laptop computer to products under drop conditions, and improve the design. The initial design of laptop and cushion package structure was built up with Creo. According to the actual physical drop test conditions, the drop simulation model was established, and the product drop acceleration curve and stress-strain nephogram were obtained by ABAQUS/Explicit simulation analysis. According to the simulation results, the cushion package design was improved, and the improved scheme was simulated and analyzed again and verified by experiment. The front-surface drop acceleration of the initial design scheme was up to 160.1g, exceeding the allowable value of 120g, and the plastic strain of the keyboard shell was up to 4.95%, presenting a greater risk of deformation. After the improvement of the cushion structure, the drop acceleration of the front, side, and bottom surfaces was 118.5g, 98.2g, and 101.2g, respectively, within the allowable value range. The plastic strain of keyboard shell was reduced to 0.14%, meeting the requirements. In addition, the simulation results were basically consistent with the actual measurement results, and the simulation process could better reflect the drop collision process between the packaged product and the product. The drop simulation analysis by finite element analysis method can quickly and accurately find the risk points of the packaging scheme compared with the traditional test method, which can lay a good foundation for the design improvement of the cushion package.