补强型透明电子灌封胶的制备及性能

为了改善透明电子灌封胶的力学性能,采用加成反应制备了补强型室温固化透明电子灌封胶。首先,通过开环聚合制备乙烯基封端的聚硅氧烷;以硅氢基封端的聚硅氧烷为交联剂,在铂配合物的催化作用下,制备得到可室温固化的透明型灌封基胶。采用MQ硅树脂对基胶进行补强,研究了MQ硅树脂的含量对灌封胶透光性、力学和绝缘性能的影响。结果表明,MQ硅树脂在含量15份时,补强型灌封胶的可见光透过率、电阻率、拉伸强度分别达到84%、2.77×1014Ω·cm、5.2 MPa;MQ硅树脂的适量加入有效提高了灌封胶的力学性能;试样在热老化和湿热老化之后仍保持优良的光学、力学和绝缘性能。

Preparation and properties of reinforced transparent electronic encapsulant

To improve the mechanical property of transparent electronic encapsulant, reinforced transparent electronic encapsulant was obtained by additional method at room temperature. Firstly, vinyl-terminated polysiloxane was synthesized by ring-opening polymerization. Using Si-H-terminated polysiloxane as crosslinking agent and platinum complexes as catalyst, the transparent gum that cured at room temperature was prepared and subsequently reinforced by filling in MQ silicone resin. The influence of the amount of MQ silicone resin on the transmittance, mechanics, and insulation performance of the encapsulant was studied. The results indicate that the tensile strength, transmittance, and resistivity of the encapsulant reach 5.2 MPa, 84%, and 2.77×10¹⁴ Ω·cm, respectively, when the MQ silicone resin content is 15 phr; the mechanics performance is markedly improved when a suitable quantity of MQ silicone resin is filled in; the mechanics, transmittance, and insulation performance of the encapsulant is excellent after thermal aging, damp and thermal aging.