| 高体分比SiCp/Al复合材料的近净成形技术 |
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| 引用本文： | 曲选辉,任淑彬,吴茂,何新波,尹海清,秦明礼.高体分比SiCp/Al复合材料的近净成形技术[J].中国材料进展,2010,29(11). |
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| 作者姓名： | 曲选辉 任淑彬 吴茂 何新波 尹海清 秦明礼 |
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| 作者单位： | 北京科技大学新材料技术研究院,北京,100083 |
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| 基金项目： | 国家973计划项目(2006CB605207); 国家自然科学基金项目(50774005) |
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| 摘 要： | 高体积分数SiCp/Al复合材料具有优异的热物理性能,且密度较低,是非常理想的电子封装材料。但是由于其本身高的脆性和硬度,使得该材料很难通过二次机械加工成所需要的形状,严重制约了该材料的应用。采用粉末注射成形-无压熔渗工艺成功实现了高体积分数SiCp/Al复合材料的近净成形。采用该工艺所制备的复合材料的致密度高于99%,可实现热膨胀系数在(5~7)×10-6K-1范围内进行调节,材料的热导率高于185 W/(m.K),抗弯强度高于370 MPa,气密性可达10-11Pa.m3.s-1,各项指标均可以满足电子封装对材料的性能要求,另外为了实现SiCp/Al复合材料与其他材料的封接,项目成功开发了一种Al-Si-Cu系焊料,封接后器件的各项性能指标尤其是气密性也均能满足使用要求。
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| 关 键 词： | 铝基复合材料 SiC 成形 电子封装 |
Near Net-Shape Forming of High Volume Fraction SiCp/Al Composites |
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| Authors: | QU Xuanhui REN Shubin WU Mao HE Xinbo YIN Haiqing QIN Mingli |
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| Affiliation: | QU Xuanhui,REN Shubin,WU Mao,HE Xinbo,YIN Haiqing,QIN Mingli(Institute for Advanced Materials and Technology,University of Science and Technology Beijing,Beijing 100083,China) |
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| Abstract: | High volume fraction SiCp/Al composite is a perfect electronic packaging material because of its excellent thermal-physical properties and lower density.However,this material has not been widely used in the field of packaging because it is hard to be machined into complex-shape due to its greater hardness and brittleness.In this paper,the preparation of SiC preforms by ceramic injection molding(CIM),pressureless infiltration of SiC preforms by Al alloys and some other basic questions have all been studied t... |
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| Keywords: | Al matrix composites SiC forming electronic packaging |
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