基板烧结中的空洞问题及措施

微波组件中的基板烧结有多种方式,但普遍存在烧结空洞率难以控制的问题,从而使产品质量和性能无法达到预定要求。采用真空烧结方法以解决基板烧结中空洞率高的问题,通过对基板烧结中造成空洞的原因进行试验分析,针对不同因素采取不同的措施。同时对基板烧结工艺进行了较为系统的研究,详细阐述了基板真空烧结的工艺过程,总结了工艺流程,并对工艺细节作出了详细说明。

Problem of Void Rate in Substrate Sintering and Its Measures

There are many sintering methods for substrate sintering in microwave components,but it is difficult to control the sinter cavity rate,which makes the product quality and performance unable to meet the predetermined requirements.This paper introduces the method of vacuum sintering to solve the problem of large sinter hole rate.Through the analysis of the cause of cavity in the sintering of substrate,different measures are taken according to different factors.At the same time,the sintering process of the substrate is studied systematically,the process of vacuum sintering of the substrate is described in detail,and the process is summarized.