| Abstract: | Polyamide/epoxysilane (coupling agent) composites were reacted with poly(dimethylsiloxane) (PDMS), a condensation product of diethoxydimethylsilane (DEDMS), by a sol–gel process. Polyamide–PDMS nanocomposites were obtained. The existence of the condensation product of DEDMS and the reaction between the epoxy group and the polyamide were confirmed with Fourier transform infrared, attenuated total reflection, and wide‐scanning X‐ray photoelectron spectroscopy. Atomic force microscopy and contact‐angle measurements showed that the surface properties of polyamide were greatly improved by the addition of PDMS. The pyrolysis temperature of polyamide with PDMS was approximately 400°C, and the pyrolysis temperature was similar to that of pure polyamide. Also, the char contents increased with the addition of PDMS. The glass‐transition temperature of polyamide with or without PDMS was approximately 140°C according to differential scanning calorimetry. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 94: 1947–1955, 2004 |
