| 功率电子封装技术及确定其热阻的实现方法研究 |
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| 引用本文： | 王旭,陶乾.功率电子封装技术及确定其热阻的实现方法研究[J].电子电路与贴装,2005(6):35-40. |
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| 作者姓名： | 王旭 陶乾 |
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| 作者单位： | [1]重庆交通学院 [2]国家客车质量检验中心 |
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| 摘 要： | 随着用户对功率电子散热效果要求的提高，早先在功率封装上附加散热片的方法实现起来很困难。本文在介绍了功率电子器件的工艺技术后，详细地讨论了封装技术对功率电子的重大影响，并以热增强型封装、热插片封装为例，描述了功率封装的动、静态特性，并给出了计算热阻的处理步骤和测量电路，具有一定的参考价值。
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| 关 键 词： | 功率工艺 功率封装 散热片 热阻 功率半导体 |
Power Package and Realistic Method of Thermal Resistance Calculation |
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| WANG Xu, TAO Qian.Power Package and Realistic Method of Thermal Resistance Calculation[J].Electronics Circuit & SMT,2005(6):35-40. |
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| Authors: | WANG Xu TAO Qian |
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| Abstract: | As users have higher demands to the result of heat sink of the power component, setting heat sinker on the power package is not easy to realize any more. The technics of power component is introduced. Then the great influence of package on power component is illustrated. This paper takes the thermal enhancement-type package and thermal tab package for examples to describe their static and dynamic characteristics. At last the measure steps and circuit of thermal resistance design are presented and have certain referential value. |
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| Keywords: | power technics power package heat sink thermal resistance |
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