Liquid-state interfacial reactions in Sn–Zn/Pd couples and phase equilibria of the Sn–Zn–Pd system at 260 °C

This study investigated the effects of Zn contents on the reaction products and microstructural evolution in the liquid/solid Sn–Zn/Pd interfacial reactions at 260 °C. A uniform Pd₂Zn₉ layer was formed at the Sn–9 wt.%Zn/Pd interface. The reaction phase transited from Pd₂Zn₉ to PdSn₄ when the Zn content decreased from 2 wt.% to 1 wt.%. The most striking feature is that the PdSn₄ growth was greatly suppressed with only 0.5 wt.% Zn addition in solders. Additionally, a drastic microstructural evolution was observed in the Sn–1.5 wt.%Zn/Pd reaction. The Pd₂Zn₉ layer was initially formed and then it was detached from the interface due to the decrease in the Zn content. Subsequently, the dominant phase changed to the PdSn₄ phase. Furthermore, a partial isothermal section in the Sn–Zn–Pd ternary system (less than 20 at.%Pd) at 260 °C was experimentally determined. The liquid apex of the liquid + PdSn₄ + Pd₂Zn₉ tie-triangle was located at Sn–2.7 at.%Zn–1.0 at.%Pd. The phase transition from Pd₂Zn₉ to PdSn₄ in the interfacial reactions was in good agreement with the phase equilibria relationship.