不同组合银粉对低温固化导电银浆性能的影响

通过片状银粉与不同尺寸的超细银粉、纳米银粉或球形银粉混合，制备得到不同组合的低温固化银浆。将银浆固化在玻璃上，用扫描电镜(SEM)观测其截面形貌，并测定其电学性能与粘附性能。结果表明以片状银粉1^#和类球形银粉4^#搭接有助于提高粉体间的致密度，增加组合粉体的接触性能，获得较好的导电通路。在一定银含量范围内银粉有效含量的提高有利于获得较佳的电学导通性能。附着力测试表明经低温固化后聚酯材料对银粉和ITO基材均具有较强粘结力。

The Effect of Combination Silver Particles on the Properties of Low-temperature Curing Conductive Silver Pastes

Low temperature solidified silver pastes of various combinations were prepared by mixing flake silver powder with different sizes of ultrafine silver powder, nano silver powder or spherical silver powder. The silver pastes were cured on glass, and their cross-sectional morphologies were observed by scanning electron microscopy (SEM), and their electrical properties and adhesion properties were measured. The results showed that the combination of flake silver powder 1^# and spherical silver powder 4^# improved the density between the powders, increased the contact performance of the combined powders, and obtained a better conductive path. The increase in the effective content of silver powder in a certain range of silver content was beneficial to obtain better electrical conductivity. The adhesion tests showed that the polyester material had strong adhesion to both the silver powder and ITO substrate after low temperature curing.