| 电流密度对Ni-W-B合金电沉积层结构和显微硬度的影响 |
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| 引用本文： | 曹刚敏,杨防祖,黄令,牛振江,许书楷,周绍民.电流密度对Ni-W-B合金电沉积层结构和显微硬度的影响[J].厦门大学学报(自然科学版),2000,39(6):781-785. |
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| 作者姓名： | 曹刚敏 杨防祖 黄令 牛振江 许书楷 周绍民 |
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| 作者单位： | 厦门大学化学系,固体表面物理化学国家重点实验室,物理化学研究所,福建,厦门,361005 |
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| 基金项目： | 国家自然科学基金资助项目!(29773039) |
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| 摘 要： | 采用电化学技术、ＸＲＤ、ＤＳＣ等方法研究电流密度对Ｎｉ－Ｗ－Ｂ合金电沉积、镀层结构和显微硬度的影响，结果表明：沉积电流密度提高，Ｎｉ－Ｗ－Ｂ合金电沉积层Ｗ含量增大，Ｂ含量降低，电沉积电流效率降低，所获得的合金镀层表现为亚稳态纳米晶结构，在不同电流密度下获得的Ｎｉ－Ｗ－Ｂ合金电沉积层的显微硬度值接近，约为６５０ｋｇ／ｍｍ＾２，与Ｎｉ－Ｗ合金相比有明显提高。
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| 关 键 词： | 结构 显微硬度 电流密度 镍－钨－硼合金 电沉积层 |
| 修稿时间： | 2000-06-02 |
Effect of Current Density on the Structure and Microhardness of Ni-W-B Alloy Electrodeposit |
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| CAO Gang-min,YANG Fang-zu,HUANG Ling,NIU Zhen-jiang,XU Shu-kai,ZHOU Shao-min.Effect of Current Density on the Structure and Microhardness of Ni-W-B Alloy Electrodeposit[J].Journal of Xiamen University(Natural Science),2000,39(6):781-785. |
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| Authors: | CAO Gang-min YANG Fang-zu HUANG Ling NIU Zhen-jiang XU Shu-kai ZHOU Shao-min |
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| Abstract: | Effects of current density on the electrodeposition, structure and microhardness of Ni-W-B alloy electrodeposit were studied by means of electrochemical technique, XRD and DSC. The result showed that, by the increase of current density W content in deposit was increased and B content decreased, also deposition current efficiencies decreased. The obtained NiWB alloy electrodeposit was in metastable nanocrystalline structure. The microhardness of the alloy obtained under different current densities were kept almost the same at the value near to 650 kg/mm2, which was obviously higher than that of Ni-W alloy. |
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| Keywords: | Ni-W-B alloy electrodeposition structure microhardne |
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