| 2020年电子电路技术热点 |
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| 引用本文： | 龚永林.2020年电子电路技术热点[J].印制电路信息,2021(2). |
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| 作者姓名： | 龚永林 |
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| 摘 要： | 文章归纳了2020年电子电路产业一些技术热点,主要有5G电路板设计和基材,制造方面半加成法、3D打印、直接金属化孔电镀和垂直互连结构等技术,以及集成电路封装载板技术。
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| 关 键 词： | 电子电路 电路设计 高频基材 封装载板 技术热点 |
The hot spots of electronic circuit technology in 2020 |
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| Gong Yonglin.The hot spots of electronic circuit technology in 2020[J].Printed Circuit Information,2021(2). |
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| Authors: | Gong Yonglin |
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| Abstract: | This paper summarizes some technology hotspots of electronic circuit industry in 2020 which includes 5G circuit board design and main materials,and semi additive method,3D printing,direct metallization hole electroplating in manufacturing and vertical connection structure,and integrated circuit packaging carrier technology. |
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| Keywords: | Electronic Circuit Circuit Design High Frequency Materials Packaging Carrier Technology Hotspots |
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