| T2000 SiP测试方案介绍 |
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| 引用本文： | 过海夏.T2000 SiP测试方案介绍[J].电子工业专用设备,2010,39(3):39-42,46. |
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| 作者姓名： | 过海夏 |
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| 作者单位： | 爱德万测试(苏州)有限公司上海分公司,上海,201102 |
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| 摘 要： | 随着SiP系统集成封装越来越广泛的应用,SiP在ATE上的测试面临诸多挑战。通过各种Module的灵活搭配,ADVANTEST T2000测试系统可以提供针对SiP芯片级封装的各个die/chip的功能特性测试,在一个测试平台上完成整个测试的解决方案。并且T2000架构凭借灵活的开放式框架,丰富的测试资源,高效的并行测试构架,人性化的操作界面,以及先进的测试理念为SiP测试提供了更好的低成本解决方案。
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| 关 键 词： | SiP 系统集成封装 T2000 |
T2000 SiP Test Solution |
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| GUO Haixia.T2000 SiP Test Solution[J].Equipment for Electronic Products Marufacturing,2010,39(3):39-42,46. |
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| Authors: | GUO Haixia |
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| Affiliation: | GUO Haixia (Advantest( Suzhou)Co., Ltd Shanghai Branch, Shanghai 201102, China) |
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| Abstract: | The ever-broadening applications of SiP devices give more and more challenges to SiP devices'ATE testing. Via flexible combination of variable Modules,ADVANTEST T2000 Test System can easily offer the whole testing solution aiming at different function characteristic test for SIP device. Furthermore,through flexible and open framework,abundant testing resource,highly efficient parallel test architecture,humanized operation interface and advanced testing concepts,T2000 provides better low-cost solution for Si... |
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| Keywords: | SiP System-In-Package T2000 |
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