| 聚合物弹性印章的制作工艺 |
| |
| 引用本文： | 唐海林,丁元萍.聚合物弹性印章的制作工艺[J].纳米技术与精密工程,2008,6(2):118-120. |
| |
| 作者姓名： | 唐海林 丁元萍 |
| |
| 作者单位： | 中国工程物理研究院电子工程研究所,绵阳,621900 |
| |
| 基金项目： | 中国工程物理研究院电子工程研究所科研基金 |
| |
| 摘 要： | 为了解决软光亥4技术中核心元件弹性印章的制备技术，对SU-8胶印模和聚合物弹性印章进行了工艺研究．通过多次实验和测量，获得了制作SU-8胶印模和聚合物弹性印章的稳定工艺参数，得到了表面形貌好、线条控制精确的SU-8胶印模和聚合物弹性印章样品，弹性印章特征线条尺寸在长宽高方向上为70mm×50μm×42μm，完全可满足软光刻技术要求，这为软刻蚀技术的进一步开发打下了良好的基础．
|
| 关 键 词： | 软光刻技术 弹性印章 聚二甲基硅氧烷 SU-8胶印模 |
| 文章编号： | 1672-6030（2008）02-0118-03 |
| 收稿时间： | 2007-08-16 |
| 修稿时间： | 2007年8月16日 |
Process Technology of Polymer Elastomeric Stamp |
| |
| TANG Hai-lin,DING Yuanping.Process Technology of Polymer Elastomeric Stamp[J].Nanotechnology and Precision Engineering,2008,6(2):118-120. |
| |
| Authors: | TANG Hai-lin DING Yuanping |
| |
| Affiliation: | (Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang 621900, China) |
| |
| Abstract: | Processes of SU-8 photoresist mold and polymer elastomeric stamp were researched in order to solve the technology of the key part--elastomeric stamp in the soft-lithography. Steady process parameters were obtained through a number of experiments and measurement, moreover, SU-8 photoresist mold and polymer elastomeric stamp with good surface and well figure were realized. The feature sizes on the stamp are 70 mm ×50 μm× 42μm, which can meet requests of the soft-lithography and establish advantageous basis for further exploring the soft-lithography technology. |
| |
| Keywords: | soft-lithography technology elastomeric stamp polydimethylsiloxane（PDMS） SU-8 photoresist mold |
| 本文献已被 维普 万方数据 等数据库收录！ |
