Sn–Zn low temperature solder |
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Authors: | Katsuaki Suganuma Kuen-Soo Kim |
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Affiliation: | (1) Institute of Scientific & Industrial Research, Osaka University, Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan |
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Abstract: | Low temperature soldering is one of the key technologies before the accomplishment of total lead-free conversion in electronics
industries. While Sn-Zn eutectic alloy has excellent properties as low temperature solder, it has some drawbacks. Damage by
heat exposure and corrosion in humidity are two of the main concerns. Zn has an important role in chemical properties. The
material physical properties, wetting, chemical stabilities and various reliabilities have been well understood on this alloy
system through the numerous past works. The understanding of both materials and processing aspects enables one to manufacture
sound electronic products without any serious problems. The basic properties and the current understandings on the limit of
the application of this solder are reviewed in this paper. |
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Keywords: | |
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