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EP/改性DDM体系的固化反应动力学及性能研究
引用本文:杨小华,夏建陵,张燕.EP/改性DDM体系的固化反应动力学及性能研究[J].中国胶粘剂,2011,20(12).
作者姓名:杨小华  夏建陵  张燕
作者单位:1. 中国林业科学研究院林产化学工业研究所,生物质化学利用国家工程实验室,国家林业局林产化学工程重点开放性实验室,江苏省生物质能源与材料重点实验室,江苏南京210042;中国林业科学研究院林业新技术研究所,北京 100091
2. 中国林业科学研究院林产化学工业研究所,生物质化学利用国家工程实验室,国家林业局林产化学工程重点开放性实验室,江苏省生物质能源与材料重点实验室,江苏南京210042
摘    要:采用非等温DSC(差示扫描量热)法对EP(环氧树脂)/改性DDM(4,4′-二氨基二苯基甲烷)体系的固化反应过程进行了跟踪。采用Kissinger、Ozawa、Crane和T-β(温度-升温速率)外推法等得到该固化体系的动力学参数和固化工艺条件,并对其力学性能和热变形温度进行了测定。结果表明:EP/改性DDM体系的表观活化能为49.43 kJ/mol,反应级数为0.869,固化条件为"85℃/2 h→125℃/2 h",热变形温度为130℃;与EP/DDM体系相比,该固化体系的表观活化能降低了7.0%,热变形温度下降了16.1%,拉伸强度和压缩强度提高了20%以上,而弯曲强度和弯曲模量基本上保持不变。

关 键 词:环氧树脂  4  4′-二氨基二苯基甲烷  固化反应  动力学  力学性能  热变形温度

Study on curing reaction kinetics and properties for EP/modified DDM system
Yang Xiaohua,Xia Jianling,Zhang Yan.Study on curing reaction kinetics and properties for EP/modified DDM system[J].China Adhesives,2011,20(12).
Authors:Yang Xiaohua  Xia Jianling  Zhang Yan
Abstract:The curing reaction process for EP(epoxy resin)/modified DDM(4,4′-diamino diphenyl methane) system was tracked by nonisothermal DSC(differential scanning calorimetry).The kinetics parameters and curing process conditions for the curing system were obtained by Kissinger,Ozawa,Crane and T-β(temperature-heating speed) extrapolation.And the mechanical properties and thermal deformation temperature were mensurated.The results showed that the apparent activation energy was 49.43 kJ/mol,reaction order was 0.869,curing conditions were "85 ℃/2 h→125 ℃/2 h",thermal deformation temperature was 130 ℃ for EP/modified DDM system.The apparent activation energy and thermal deformation temperature of EP/modified DDM system were 7.0% and 16.1% respectively less than those of EP/DDM system,the tensile strength and compressive strength of EP/modified DDM system were above 20% more than those of EP/DDM system,but both bend strength and bending modulus were almost unchanged.
Keywords:epoxy resin  4  4′-diamino diphenyl methane(DDM)  curing reaction  kinetics  mechanical property  thermal deformation temperature
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