基于图像区域像素二阶中心矩的集成电路芯片图像拼接技术

在集成电路芯片光学检测中,完整而准确地获取芯片形貌的图像非常重要.针对集成电路芯片表面形貌图像获取的要求,首先讨论集成电路芯片图像放大采集系统构成及工作原理,并研究图像拼接在精密芯片图像检测中的必要性及重要性,针对集成芯片的微观表面图像特征处理的要求,提出集成电路芯片的区域像素二阶中心矩图像拼接技术,通过建立图像区域像素的二阶中心矩进行匹配点的准确搜索,随后进行芯片精密显微图像的拼接.编程实验证明,采用本方法可获得集成电路芯片表面的清晰图像,并使芯片的微观形貌和细小缺陷等细节能得到很好的展现.

Image splicing technology of IC chip topography based on pixel secondary centre moment template

In process of IC chip optical detecting,it is important to gain surface feature of image completely and accurately.In order to get feature of IC chip's surface image,introduces structure and working theory of IC chip's enlarged image collecting system,discusses the importance of image splicing technology in IC chip optical detecting,and then it investigates image matching and splicing technology of IC chip base on pixel secondary centre moment template to realize splicing of chip's micro-image.This technology uses pixel secondary centre moment to search image's matching point accurately and splice digital image rapidly.Experimental result indicates that it can obtain a clear microscopic surface image.As a result,surface feature and micro defect of IC chip can be well displayed.