| Abstract: | Recombination and a number of other important factors must be considered in the optimization of the diffused regions of high‐efficiency silicon solar cells. In this paper, we examine issues related to the four types of diffusions used in rear‐junction, interdigitated backside buried contact solar cells made on n‐type silicon wafers: the phosphorus‐diffused front‐surface field (FSF), the boron‐diffused emitter, and the boron and the phosphorus diffused contact regions. Dark saturation current density, effective lifetime, implied open‐circuit voltage and sheet resistance are characterized for the optimization of the above‐mentioned diffused regions. Diffusion uniformity and the avoidance of the diffusion‐induced dislocations are also discussed for the heavily diffused, metal coated contact diffusions. It is found that the optimal sheet resistances of the FSF for planar and textured surfaces are 120 Ω/□ and 105 Ω/□ respectively, whereas the optimal post‐processing sheet resistance for the boron emitter is approximately 100 Ω/□. Moreover, sheet resistance as heavy as 10–20 Ω/□ for the boron groove diffusion and 5–10 Ω/□ for the phosphorus groove diffusion have been achieved without introducing the diffusion‐induced misfit dislocations. Careful consideration of the issues discussed here led to an absolute efficiency improvement on the planar n‐type IBBC solar cell of more than 0·6%. Copyright © 2006 John Wiley & Sons, Ltd. |
