施镀时间和浓度对碳纳米管镀Ni层厚度的影响

为降低碳纳米管的表面活化能, 改善碳纳米管与金属基体的相容性, 采用化学镀的方法, 在碳纳米管表面镀覆一层金属Ni。研究了施镀时间和镀液浓度对碳纳米管表面镀Ni层厚度的影响。结果表明: 随着施镀时间延长, Ni沉积颗粒变大导致镀Ni层变厚; 镀液浓度增加, 碳纳米管表面沉积的Ni颗粒增多, 镀Ni层逐渐致密。本实验工艺条件下, 镀液浓度为0.08 mol/L, 反应时间为30 min时, 可以在碳纳米管表面镀覆一层界面结合良好且致密的Ni层, 其厚度约为10 nm。热处理能有效缓解镀Ni层应力, 改善界面结合。

Influence of plating time and concentration on the thickness of the Ni coating on carbon nanotubes

To improve the compatibility of carbon nanotubes(CNTs) and the metal matrix by reducing the surface activation energy, the CNTs with Ni coatings were obtained by an electroless deposition process. The effects of the plating time and the concentration of plating solution on the thickness of the Ni coatings were studied. The results show that as the plating time is prolonged, the depositional particles become larger and the thickness of coatings increases. Moreover, the numbers of depositional particles increase and the coatings gradually become densified with the increase of concentration of the plating solution. The CNTs coated with a dense Ni layer can be successfully prepared with the plating solution concentration of 0.08 mol/L Ni²⁺ and the plating time of 30 min in this experiment, and the Ni layer possesses well interfacial interaction with CNTs and has a thickness of 10 nm. Heat treatment can effectively relive the stress between Ni layer and CNTs and increase interfacial interaction.