铜箔皱原因分析及改善措施

压合工序是线路板工厂中最重要的工序之一，铜皱问题是行业内推广薄铜箔最大的阻碍。文章通过自行设计简易试验装置，设计对比试验，分析了压合铜箔皱的机理，阐述了温度均匀性对铜皱的影响，完善了行业内对该问题的理论认识；提出了一种针对铜皱问题全新的解决思路和方法即通过参考树脂融化点调整压合程序的方式解决压合铜箔皱问题。

Copper wrinkle analysis and improvement

Lamination is one of the most important processes in multilayer PCB manufacture. The copper wrinkles is the most difficulty to promote thin copper application. The article analyses the theory of wrinkle throughout design facility tester and DOE, expounds the impact of temperature equality to wrinkle, consummates the theory to the crush. Besides these, a kind of brand-new idea and method is proposed through regulating lamination procedure reference to resin melt.