| 铜粉丙烯酸酯胶粘剂导电机理的探讨 |
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| 引用本文： | 陈月辉,王继虎,王锦成,吴云峰,吴建荣.铜粉丙烯酸酯胶粘剂导电机理的探讨[J].上海工程技术大学学报,2005,19(3):198-200. |
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| 作者姓名： | 陈月辉 王继虎 王锦成 吴云峰 吴建荣 |
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| 作者单位： | 上海工程技术大学化学,化工学院,上海,201620;上海工程技术大学化学,化工学院,上海,201620;上海工程技术大学化学,化工学院,上海,201620;上海工程技术大学化学,化工学院,上海,201620;上海工程技术大学化学,化工学院,上海,201620 |
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| 摘 要： | 测得了导电胶的渗滤阈值并用扫描电镜（SEM）观察胶粘剂导电通道形成的过程.从理论上讨论了铜粉丙烯酸酯胶粘剂的导电机理.
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| 关 键 词： | 胶粘剂 铜粉 丙烯酸酯 导电 机理 |
| 文章编号： | 1009-444X（2005）03-0198-03 |
| 收稿时间： | 2005-08-29 |
| 修稿时间： | 2005年8月29日 |
Research of Conductive Mechanism of Copper Powder Acrylate Adhesive |
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| CHEN Yue-hui,WANG Ji-hu,WANG Jin-cheng,WU Yun-feng,WU Jian-rong.Research of Conductive Mechanism of Copper Powder Acrylate Adhesive[J].Journal of Shanghai University of Engineering Science,2005,19(3):198-200. |
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| Authors: | CHEN Yue-hui WANG Ji-hu WANG Jin-cheng WU Yun-feng WU Jian-rong |
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| Affiliation: | College of Chemistry and Chemical Engineering, Shanghai University of Engineering Science, Shanghai 201620, China |
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| Abstract: | The percolation threshold was determined and the conducting pathway of the electric conductive adhesive was observed by SEM. The conductive mechanism of copper powder acrylate adhesive composite was discussed. |
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| Keywords: | adhesive copper powder acrylate electric conduction mechanism |
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