Role of preliminary etching for one‐step self‐etch adhesives |
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Authors: | Michael Taschner Fernando Nato Annalisa Mazzoni Roland Frankenberger Norbert Krämer Roberto Di Lenarda Anselm Petschelt Lorenzo Breschi |
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Affiliation: | 1. Dental Clinic 1 – Operative Dentistry and Periodontology, University of Erlangen, Erlangen, Germany;2. Department of SAU and FAL, University of Bologna, Bologna, Italy;3. Department of SUAN, University ‘Carlo Bo’, Urbino, Italy;4. Department of Operative Dentistry and Endodontology, University of Marburg, Marburg, Germany;5. Department of Pediatric Dentistry, University of Gie?en, Gie?en, Germany;6. Department of Biomedicine, Unit of Dental Sciences and Biomaterials, University of Trieste, Trieste, Italy;7. IGM‐CNR, Unit of Bologna c/o IOR, Bologna, Italy |
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Abstract: | Taschner M, Nato F, Mazzoni A, Frankenberger R, Krämer N, Di Lenarda R, Petschelt A, Breschi L. Role of preliminary etching for one‐step self‐etch adhesives.Eur J Oral Sci 2010; 118: 517–524. © 2010 Eur J Oral Sci The aim of this study was to analyse the effect of preliminary phosphoric acid etching of enamel and dentine before the application of two, one‐step self‐etch adhesive systems. The systems were applied onto acid‐etched or smear‐layer‐covered enamel and dentine. The treatment groups were as follows: group 1, Adper Easy Bond (3M ESPE) on etched substrate; group 2, Adper Easy Bond (control); group 3, iBond Self‐Etch (Heraeus Kulzer) on etched substrate; and group 4, iBond Self‐Etch (control). Enamel and dentine bond strengths were calculated using microshear and microtensile bond‐strength tests. Additional specimens were prepared to evaluate nanoleakage at the dentine–adhesive interface and were investigated using light microscopy or transmission electron microscopy. Both adhesives demonstrated higher microshear bond strengths when enamel was pre‐acid‐etched with phosphoric acid (Adper Easy Bond 28.7 ± 4.8 MPa; iBond Self‐Etch 19.7 ± 3.6 MPa) compared with controls (Adper Easy Bond 19.2 ± 3.3 MPa; iBond Self‐Etch 17.5 ± 2.7 MPa) and increased microtensile bond strength when applied on acid‐etched (Adper Easy Bond 35.8 ± 5.7 MPa; iBond Self‐Etch 24.3 ± 7.9 MPa) vs. smear‐layer‐covered dentine (Adper Easy Bond 26.9 ± 6.2 MPa; iBond Self‐Etch 17.6 ± 4.3 MPa). Adper Easy Bond showed lower nanoleakage than iBond Self‐Etch, irrespective of preliminary etching. The results of this study support the use of phosphoric acid etching before the application of one‐step self‐etch adhesive systems. |
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Keywords: | dentine bonding systems etching microtensile self‐etch |
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