| LGA器件焊点缺陷分析及解决 |
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| 引用本文： | 王文龙,陈帅,谭小鹏.LGA器件焊点缺陷分析及解决[J].印制电路信息,2021(1). |
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| 作者姓名： | 王文龙 陈帅 谭小鹏 |
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| 作者单位： | 西安导航技术研究所 |
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| 摘 要： | 文章针对LGA器件回流焊后常见的空洞和锡珠等缺陷,对其产生的原因进行了分析。通过对LGA器件采用预上锡回流工艺和印制板钢网一字架桥开口的方式,提升回流焊过程中焊膏中挥发气体的逸出,并通过对比试验,找到合适的预上锡钢网尺寸,解决了生产中LGA器件焊接常见的空洞大等缺陷。
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| 关 键 词： | 焊盘网格阵列器件 焊接空洞 锡珠 预上锡 |
Ananysis and solution of solder joint defects in LGA devices |
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| Wang Wenlong,Chen Shuai,Tan Xiaopeng.Ananysis and solution of solder joint defects in LGA devices[J].Printed Circuit Information,2021(1). |
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| Authors: | Wang Wenlong Chen Shuai Tan Xiaopeng |
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| Affiliation: | (Xi’an navigation technology research institute,Xi’an Shaanxi,710068) |
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| Abstract: | In this paper,the causes of defects such as voids and solder ball after reflow soldering of LGA devices are analyzed.Through the pre tin reflow process and the way of bridging the opening at the LGA devices of PCB steel mesh,the escape of volatile gas during reflow soldering process is improved.Through the comparative test,theappropriate size of pre tin mesh is found,and the detects such as large voids are solved. |
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| Keywords: | LGA Device Soldering Voids Solder Ball Pre Tin |
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