基于钎料层厚度优化磨抛盘磨料粒度的仿真研究

采用热弹塑性有限元方法对钎焊金刚石磨抛盘真空钎焊过程进行建模与仿真,运用ABAQUS有限元分析软件,对其钎焊后冷却过程的瞬态温度场和应力场进行模拟,得出钎料层是影响磨抛盘钎焊后应力及变形量大小的重要因素。分析不同钎料层厚度时磨抛盘钎焊后的应力及变形量,合理确定在一定基体厚度情况下,钎料层厚度的最大值为0.2mm。结合钎料层厚度与磨粒高度的合理匹配关系,在理论上确定了钎焊金刚石磨抛盘可用的最大磨料粒度为30/35目。

Optimization of the grit size of diamond grinding disc based on the thickness of brazing filler

The thermal elastic-plastic finite element model was used to model and simulate vacuum brazing process of brazed diamond grinding disc.The finite element analysis software ABAQUS was used to simulate the transient temperature field and stress field of cooling process.It was concluded that the brazing filler was the main factor determining the value of stress and deformation of brazed diamond grinding disc.In the condition of certain thickness of substrate,the stress and deformation of brazed diamond grinding discs with different thickness of brazing fillers were analyzed.The maximum value of the thickness of brazing filler was reasonably determined to be 0.2mm.Combined with the rational matching relations of the thickness of brazing filler and the height of the grain,the maximum grit size of brazed diamond grinding disc could be 30/35 in theory.