|
|||||
|
|
Partition-Based Global Placement Considering Wire-Density Uniformity for CMP Variations |
|
| Authors: | DONG Changdao ZHOU Qiang CAI Yici LIU Dawei |
| Affiliation: | DONG Changdao,ZHOU Qiang,CAI Yici,LIU Dawei Tsinghua National Laboratory for Information Science and Technology,Department of Computer Science and Technology,Tsinghua University,Beijing 100084,China |
| Abstract: | This paper presents a multilevel hypergraph partitioning method that balances constraints on not only the cell area but also the wire weight with a partition-based global placement algorithm that maximizes the wire density uniformity to control chemical-mechanical polishing (CMP) variations.The multilevel partitioning alternately uses two FM variants in the refinement stage to give a more uniform wire distribution.The global placement is based on a top-down recursive bisection framework.The partitioning alg... |
| Keywords: | partitioning placement chemical-mechanical polishing (CMP) design for manufacturing (DFM) wire-density |
| 本文献已被 CNKI 万方数据 等数据库收录！ | |
