| 电引发化学镀铜机理及应用 |
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| 引用本文： | 孙俊杰,倪超,陆然,赵鹏,田瑞杰.电引发化学镀铜机理及应用[J].印制电路信息,2012(7):25-27,54. |
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| 作者姓名： | 孙俊杰 倪超 陆然 赵鹏 田瑞杰 |
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| 作者单位： | 深南电路有限公司,广东深圳,518117 |
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| 摘 要： | 主要论述了印制电路板化学镀铜所采用的电引发起镀技术及其作用机理,同时给出其应用方法。
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| 关 键 词： | 电引发 化学镀铜 机理 应用 |
Study on mechanism and application of electro-induced Electroless Copper process |
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| SUN Jun-jie,NI Chao,LU Ran,ZHAO Peng,TIAN Rui-jie.Study on mechanism and application of electro-induced Electroless Copper process[J].Printed Circuit Information,2012(7):25-27,54. |
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| Authors: | SUN Jun-jie NI Chao LU Ran ZHAO Peng TIAN Rui-jie |
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| Affiliation: | SUN Jun-jie NI Chao LU Ran ZHAO Peng TIAN Rui-jie |
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| Abstract: | This article mainly introduced the electro-induced deposition in PTH process and its effect mechanism, meanwhile, its application method is given out. |
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| Keywords: | Electro-induced Electroless Copper Mechanism Application |
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