| PCB高稳定性中速化学镀铜工艺研究 |
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| 引用本文： | 谢金平,王群,王恒义.PCB高稳定性中速化学镀铜工艺研究[J].印制电路信息,2012(6):25-27,59. |
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| 作者姓名： | 谢金平 王群 王恒义 |
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| 作者单位： | 广东致卓精密金属科技有限公司,广东佛山,528247 |
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| 摘 要： | 主要研究微量添加剂对化学镀铜镀液沉积速率及镀液稳定性的影响,通过试验筛选合适的微量添加剂,在不改变化学镀铜镀液主反应物质含量的情况下实现镀速提高和镀液稳定性增加。开发出的高稳定性中速化学镀铜工艺,其性能满足PCB工业化生产。
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| 关 键 词： | 化学镀铜 沉积速率 微量添加剂 PCB |
A study on the process of medium-speed electroless copper plating on PCB with high stability |
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| XIE Jin-ping,WANG Qun,WANG Heng-yi.A study on the process of medium-speed electroless copper plating on PCB with high stability[J].Printed Circuit Information,2012(6):25-27,59. |
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| Authors: | XIE Jin-ping WANG Qun WANG Heng-yi |
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| Affiliation: | XIE Jin-ping WANG Qun WANG Heng-yi |
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| Abstract: | In this paper it is studied the effect of trace additives on the deposition rate and bath stability of electroless copper plating.The plating rate and stability of plating solution both was significantly improved by testing appropriate trace additives and the main reactive substances content of electroless copper plating bath did not change.The object is to develop a high stability of medium-speed electroless copper plating process,the performance to meet the industrial production of PCB. |
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| Keywords: | electroless copper plating deposition rate trace additives PCB |
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