| 静电卡盘静电吸附力影响因素的有限元分析 |
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| 引用本文： | 王兴阔,程嘉,王珂晟,杨义勇,孙钰淳,曹明路,季林红.静电卡盘静电吸附力影响因素的有限元分析[J].半导体学报,2014,35(9):094011-5. |
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| 作者姓名： | 王兴阔 程嘉 王珂晟 杨义勇 孙钰淳 曹明路 季林红 |
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| 基金项目： | 02国家科技重大专项（项目编号：2011ZX02403） |
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| 摘 要： | As one of the core components of IC manufacturing equipment, the electrostatic chuck （ESC） has been widely applied in semiconductor processing such as etching, PVD and CVD. The clamping force of the ESC is one of the most important technical indicators. A multi-physics simulation software COMSOL is used to analyze the factors influencing the clamping force. The curves between the clamping force and the main parameters such as DC voltage, electrode thickness, electrode radius, dielectric thickness and helium gap are obtained. Moreover, the effects of these factors on the clamping force are investigated by means oforthogonal experiments. The results show that the factors can be ranked in order of voltage, electrode radius, helium gap and dielectric thickness according to their importance, which may offer certain reference for the design of ESCs.
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| 关 键 词： | 有限元分析 静电 锁模力 吸盘 介质厚度 直流电压 夹紧力 ESC |
Finite element analysis on factors influencing the clamping force in an electrostatic chuck |
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| Wang Xingkuo,Cheng Ji,Wang Kesheng,Yang Yiyong,Sun Yuchun,Cao Minglu and Ji Linhong.Finite element analysis on factors influencing the clamping force in an electrostatic chuck[J].Chinese Journal of Semiconductors,2014,35(9):094011-5. |
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| Authors: | Wang Xingkuo Cheng Ji Wang Kesheng Yang Yiyong Sun Yuchun Cao Minglu and Ji Linhong |
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| Affiliation: | School of Engineering and Technology, China University of Geosciences (Beijing), Beijing 100083, China;Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China;Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China;Department of Mechanical Engineering, Academy of Armored Force Engineering of PLA, Beijing 100072, China;School of Engineering and Technology, China University of Geosciences (Beijing), Beijing 100083, China;Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China;Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China;Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China |
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| Abstract: | As one of the core components of IC manufacturing equipment, the electrostatic chuck (ESC) has been widely applied in semiconductor processing such as etching, PVD and CVD. The clamping force of the ESC is one of the most important technical indicators. A multi-physics simulation software COMSOL is used to analyze the factors influencing the clamping force. The curves between the clamping force and the main parameters such as DC voltage, electrode thickness, electrode radius, dielectric thickness and helium gap are obtained. Moreover, the effects of these factors on the clamping force are investigated by means of orthogonal experiments. The results show that the factors can be ranked in order of voltage, electrode radius, helium gap and dielectric thickness according to their importance, which may offer certain reference for the design of ESCs. |
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| Keywords: | electrostatic chuck clamping force COMSOL simulation orthogonal experiment |
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