| 银含量对随机振动条件下无铅焊点可靠性的影响 |
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| 引用本文： | 杨金丽,雷永平,林健,张寒.银含量对随机振动条件下无铅焊点可靠性的影响[J].电子元件与材料,2012(9):40-44. |
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| 作者姓名： | 杨金丽 雷永平 林健 张寒 |
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| 作者单位： | 北京工业大学材料科学与工程学院 |
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| 基金项目： | 现代焊接生产技术国家重点实验室课题基金资助项目(No.09010);北京市自然科学基金资助项目(No.3102002);重点项目基金资助项目(No.KZ20110005002) |
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| 摘 要： | 为了探究银含量对无铅焊点在随机振动条件下的可靠性的影响,对Sn-3.0Ag-0.5Cu、Sn-1.0Ag-0.5Cu和Sn-0.3Ag-0.7Cu三种不同Ag含量材料的焊点做窄带范围内的随机振动疲劳实验,并对失效焊点进行分析。结果表明:三种材料焊点的失效位置基本都在靠近PCB侧,最外围焊点最容易失效,失效模式均为脆性断裂,并且随着Ag含量的降低,金属间化合物的厚度逐渐减小,焊点的疲劳寿命逐渐延长。
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| 关 键 词： | 无铅焊点 银含量 随机振动 失效机理 疲劳寿命 |
Influence of silver content on the reliability of lead-free solder joints under random vibration conditions |
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| YANG Jinli,LEI Yongping,LIN Jian,ZHANG Han.Influence of silver content on the reliability of lead-free solder joints under random vibration conditions[J].Electronic Components & Materials,2012(9):40-44. |
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| Authors: | YANG Jinli LEI Yongping LIN Jian ZHANG Han |
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| Affiliation: | (College of Material Science and Engineering,Beijing University of Technology,Beijing 100124,China) |
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| Abstract: | In order to explore the effect of the silver content of lead-free solder joints reliability in the random vibration condition,narrow-band random vibration fatigue tests were respectively carried out with three different kinds of materials(Sn-3.0Ag-0.5Cu,Sn-1.0Ag-0.5Cu and Sn-0.3Ag-0.7Cu).Failed BGA solder joints were cross-sectioned and metallurgical analysis was done to investigate failure mechanisms of BGA lead-free solder joints under random vibration loading.The results show that the most of failures of three kinds of solder joints locate PCB side,periphery solder joints are most likely to fail,and the failure modes are all brittle fractures.With the decrease of Ag content,the thickness of IMC gradually decreases,while the fatigue life of solder joints gradually extends. |
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| Keywords: | lead-free solder joint silver content random vibration the failure mechanism fatigue life |
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