切割速度对硅片翘曲的影响

根据线切割机的工作原理,结合12英寸(1英寸=2.54 cm)单晶直径大、SiC磨削路线长和磨削发热量大的特点,制定了包括线速度、耗线量、砂浆温度、砂浆流量及各部分温度的工艺参数。根据单位时间内钢线的切割面积相等的理论设计了对称变化的切割速度曲线,又根据砂浆磨削能力的影响设计了非对称变化的切割速度曲线。用两种切割速度变化曲线进行了对比实验,根据实验结果确定在实际切割中必须考虑砂浆磨削能力的影响从而必须采用非对称的切割速度变化曲线。分析了影响线切割机加工质量的因素,并且给出了提高线切割机加工质量的改善方向。

Influence of Slicing Speed on Wafer Warp

The 12″ crystal has a large diameter,a long grinding track of SiC and a high thermal slicing process.Based on the working principle of the multi-wire saw process,the process parameters were defined,including the wire speed,the wire consumption,the slurry temperature,the slurry flow and the temperature of the some key parts in the multi-wire saw machine.A symmetrical changing slicing speed profile was designed according to the theory that the slicing area is equal at per unit time.An nonsymmetrical changing slicing speed profile was set by the slicing ability of the slurry.The two profiles were studied by the comparison tests.The tests show that the slicing ability of the slurry must be ensured using the nonsymmetrical changing profile of slicing speed.The factors that affect the slicing quality were analyzed,and the suggestions for the quality improvement were provided.