| 无氰镀金工艺的研究 |
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| 引用本文： | 冯慧峤,安茂忠,杨培霞,张锦秋.无氰镀金工艺的研究[J].电镀与环保,2011,31(1):8-11. |
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| 作者姓名： | 冯慧峤 安茂忠 杨培霞 张锦秋 |
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| 作者单位： | 哈尔滨工业大学化工学院,黑龙江,哈尔滨,150001 |
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| 摘 要： | 传统的亚硫酸盐镀金液稳定性较差,就添加剂对镀液稳定性的影响进行了研究,并对镀层及镀液性能进行了测试.结果表明:镀层结晶细致,结合力、耐蚀性良好;镀液无毒、稳定性良好、分散能力和覆盖能力良好.新工艺有望取代氰化物镀金工艺,具有广阔的发展前景.
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| 关 键 词： | 无氰 镀金 添加剂 |
A Study of Non-cyanide Gold Electroplating |
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| FENG Hui-qiao,AN Mao-zhong,YANG Pei-xia,ZHANG Jin-qiu.A Study of Non-cyanide Gold Electroplating[J].Electroplating & Pollution Control,2011,31(1):8-11. |
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| Authors: | FENG Hui-qiao AN Mao-zhong YANG Pei-xia ZHANG Jin-qiu |
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| Affiliation: | (College of Chemical Engineering and Technology,Harbin Institute of Technology,Harbin 150001,China) |
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| Abstract: | Since traditional sulfite gold plating electrolyte has the problem with bath stability,the effects of additives on bath stability were investigated,and the properties of the coating and bath were tested.The results show that the coating obtained by the new process has fine crystals,good adhesion and corrosion resistance;and the new gold plating bath,nontoxic and stable,has a good throwing power and covering power.The new process would likely substitute for cyanide gold plating process,and has a broad developing prospect. |
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| Keywords: | non-cyanide gold plating additive |
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