磨料有序排布电镀砂轮的制备及其把持力研究

为解决电镀砂轮磨削加工中容屑空间不足的问题，采用点胶微粘接的方法制备了磨料有序排布的电镀砂轮，分析了磨料粘接效果和镀层力学性能。通过SEM分析了磨料/镀层/导电胶的结合界面，并进行了干磨削试验。研究结果表明，直径约为磨料粒径40%的胶点可粘接住磨料，单个胶点上粘接多颗磨料的占比小于6%；双脉冲电镀工艺制备的镀层显微硬度大于500HV，表层残余应力小于100MPa，磨料/镀层/导电胶之间的界面贴合紧密，无明显缺陷；砂轮在磨削时没有出现磨料脱落现象。     

高精度测微计在车轴测量机上的应用方案

介绍了高精度测微计用于车轴直径测量的基本结构、关键技术及其在车轴测量设备上的应用。     

M1080B无心外圆磨床改进

M1080B无心外圆磨床砂轮及导轮宽度较窄,磨削轴承套圈外圆时,磨削效率低,托板架调整较为繁琐、皮带打滑、磨损较为严重。针对上述问题,提出了相应的解决办法,提高了磨削效率。     

埋地管道泄漏内封堵装置设计与研究

针对流体输送埋地管道泄漏问题,设计了一种利用管道机器人携带封堵气囊进行快速应急封堵修复的埋地管道泄漏内封堵装置。采用矩阵变换方法建立了牵引系统驱动轮过弯方程,利用MATLAB软件对过弯方程进行了验证,同时利用ADAMS软件仿真分析过弯路径与驱动轮转角对牵引系统行走速度的影响。研究结果表明:由两个串联封堵器组成的应急封堵系统可满足复杂工况下的管道泄漏封堵要求;牵引系统驱动轮在弯管内部行走时,单轮速度呈周期性变化,但三个驱动轮整体周期运动特性一致;驱动轮转角在25°~40°时,牵引系统行走速度与驱动轮转角成正比,且转角为30°时驱动效果最好。该内封堵装置的结构设计可为管道泄漏应急封堵领域装备的研发提供重要参考。     

Effect of grinding-induced cyclic heating on the hardened layer generation in the plunge grinding of a cylindrical component

This paper discusses the effects of the grinding-induced cyclic heating on the properties of the hardened layer in a plunge cylindrical grinding process on the high strength steel EN26. It was found that a multi-pass grinding brings about a uniform and continuous hardened layer along the circumference of the cylindrical workpiece. An increase of the number of grinding passes, leads to a thicker layer of hardening, a larger compressive residual stress and a deeper plastic deformation zone. Within the plastic deformation zone, the martensitic grains are refined by the thermo-mechanical loading, giving rise to a hardness of 12.5% higher than that from a conventional martensitic transformation. The coupled effects of heat accumulation and wheel wear in the multi-pass grinding are the main causes for the thickening of the hardened layer. A too small infeed per workpiece revolution would result in insufficient grinding heat, and in turn, bring about an undesirable tempered hardened layer and a reduction of its hardness.     

多区双重介质复合气藏渗流数学模型及其压力动态

四川盆地大多数气藏属于裂缝孔隙型气藏,气藏非均质性强.经典的径向均质复合试井解释模型与气藏实际情况不相符,解释结果与实际地质情况出现抵触现象.针对这种情况,建立了多区双重孔隙介质复合地层模型,求得了该模型的拉氏空间解,分析了其典型的压力动态特征,并对影响因素可能对曲线产生的影响进行了分析.     

A New Comb Circular Polarizer Suitable for Millimeter‐Band Application

This letter presents a new polarizer which has a simple comb structure inside a circular waveguide. The electrical performance of the proposed comb polarizer is optimized by a circular waveguide radius and by the physical parameters of the comb plates. This polarizer is suitable for providing good performance in millimeter‐band application because of its simple structure and low fabrication cost. In our experiments the dual‐band comb polarizer designed in band 1(K) and band 2(Ka) showed good electrical performance without any tuning elements.     

IEEE 802.11g性能分析及应用

全面介绍IEEE802.11g标准的无线局域网,详细讲述IEEE802.11g草案标准的概念、产生背景、特点、构件及其体系结构和发展前景,探讨实现IEEE802.11gWLAN所需的关键技术及其双频多模应用方式,同时分析IEEE802.11g标准的网络性能。     

Characterization and optimization of copper chemical mechanical planarization

The feature scale planarization of the copper chemical mechanical planarization (CMP) process has been characterized for two copper processes using Hitachi 430-TU/Hitachi T605 and Cabot 5001/Arch Cu10K consumables. The first process is an example of an abrasive-free polish with a high-selectivity barrier slurry, while the second is an example of a conventional abrasive slurry with a low-selectivity barrier slurry. Copper fill planarization has been characterized for structures with conformal deposition as well as with bumps resulting from bottom-up fill. Dishing and erosion were characterized for several structures after clearing. The abrasive-free polish resulted in low sensitivity to overpolish and low saturation levels for dishing and erosion. Consequently, this demonstrated superior performance when compared to the International Technology Roadmap for Semiconductors (ITRS) 2000 roadmap targets for planarization. While the conventional slurry could achieve the 0.13-μm technology node requirements, the abrasive-free polish met the planarization requirements beyond the 0.10-μm technology node.     

光纤0_2/CO_2复合传感器的研制

本文报导一种新型的光纤氧、二氧化碳复合传感器.通过在同一敏感膜载体上固定两种不同的荧光试剂——芘丁酸及羟基芘三磺酸,制作了一种对氧和二氧化碳敏感的复合敏感膜.该传感器在医学临床检验范围内具有良好的线性,其测氧的分辩率是0.1％,测二氧化碳的分辩率是0.5％,响应时间短于1min.文中还讨论了三种敏感膜载体的比较及复合传感器测量进程中氧和二氧化碳的相互干扰问题.